DESTRUCTIVE PHYSICAL ANALYSIS
(DPA)

The lifetime of electronic components follows a predictable trend. A significant number of components fail prematurely at a very early age ("infant mortality"). Once past this initial failure stage, they usually perform for a long period of time with a low probability of failure.

Higher reliability electronic components are often required to operate for long periods of time, having little or no opportunity for replacement. Orbiting satellites are good examples of this situation. Parts that meet the requirements for "space usage" are also used in applications where replacement is difficult and/or failure engenders great risk.

The infant mortality problem can be addressed by the implementation of stringent quality controls during manufacturing. SEM examination of metallization, glassivation analysis, thorough percap inspection, electrical burn-in, and DPA procedures will identify respective problems.

Destructive Physical Analysis (DPA) is performed at SEAL Laboratories on materials used in aerospace, commercial, military, and government applications. Our facilites are complete and DSCC certified for various MIL-STD testing requirements. Testing capabilities include Fine Leak, Gross Leak, Die Shear, Bond Strength, P.I.N.D. Testing, Radiography, SEM inspection, Microsectioning, Solvent Resistance, Solderability Screening, and DSCC Certified RGA Testing.

DPA is routinely used by the aerospace industry in order to qualify electronic components to Class "S". More and more commercial applications are using DPA screening to dramatically increase the reliability of their products in the field.

                             For more information on DPA analysis, contact: Evans Ryan