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USE OF MICROANALYTICAL TECHNIQUES IN PRINTED CIRCUIT BOARD FAILURE ANALYSIS |
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Purpose :
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A One-Day Course with Lectures and Laboratory Demonstrations |
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Dated
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Date To Be Determined - Please Call |
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Types of Problems Discussed |
Failure Analysis,
Surface Contamination Analysis,
Quality of Plated Through Holes,
Corrosion Problems,
Solderability Problems,
Plating Problems,
Laminate Material Problems
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Microanalytical Techniques |
Scanning Electron Microscopy (SEM),
Energy Dispersive X-ray Analysis (EDX),
Auger Electron Spectroscopy (AES),
Electron Spectroscopy for Chemical Analysis (ESCA),
Fourier Transform Infra-Red Spectroscopy (FTIR),
Differential Scanning Calorimetry (DSC),
Metallographic Cross-Sectioning of PCB
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You will learn: |
How these techniques work,
The advantages and limitations,
What types of problems each can solve,
How to decide which to use |
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Course Includes: |
Five hours of lectures,
Three hours of laboratory demonstrations of the various microanalytical techniques |
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Seminar